Hoʻolaha nā mea hana maikaʻi i kahi kaʻina hana hana mua, ʻo ia ka holomua o ka stamping, molding, computer numerical control (CNC) huli, a pēlā aku.

Loaʻa i nā mea hana maikaʻi loa ko lākou ʻike hana mua a me kahi ʻano o nā lawelawe lua i hiki iā lākou ke hāʻawi i kā lākou mea kūʻai aku i nā huahana piha loa. Hana ʻo Bracalente Manufacturing Group (BMG) i kēlā.

ʻO kā mākou ʻike mua i ka hoʻohuli ʻana a me nā kaʻina hana wili CNC, akā hāʻawi pū mākou i kahi hui piha o nā hana lua. ʻO kēia mau hana lua e ʻae iā mākou e hāʻawi i nā ʻāpana mīkini maikaʻi loa i ka pae kiʻekiʻe o ka hoʻopau ʻana a kōkua iā mākou e mālama i ko mākou inoa honua ma ke ʻano he alakaʻi alakaʻi i nā mea hoʻoponopono hana.

ʻIlikai ʻili

Ma waena o nā lawelawe ʻelua e hāʻawi ʻia e BMG he mau hana hoʻopau metala. Hāʻule kēia mau kaʻina hana i hoʻokahi o ʻekolu mau ʻano maʻamau: hoʻopau mechanical, e like me ka wili a me ka honing; ka hoʻomaʻamaʻa wela metala, e komo pū ana me nā hana e like me ka annealing, no ka ikaika; a me ka lapaʻau ili metala.

ʻO ka lāʻau lapaʻau metala kekahi kaʻina hana e hoʻopili, hoʻololi, a hoʻohui paha i ka ʻili o kahi ʻāpana metala. Ke ʻimi nei kēia mau lapaʻau e hana i nā ʻano hana like ʻole; ʻoiai ʻo ka pale ʻana i ka corrosion ka mea maʻamau i hoʻohana ʻia, ʻokoʻa ke kumu o kēlā me kēia ʻano.

Nā Kaʻina Hana Uila

ʻImi ʻia nā kaʻina hana uhi a hoʻopalapala ʻia e hoʻololi i ka ʻili o nā ʻāpana metala ma kahi pae molekala a i ʻole e uhi pono iā ia. ʻO ka pahuhopu o kēia mau kaʻina hana, ʻo ia wale nō ka pale ʻana i ka corrosion. ʻO kekahi o nā lawelawe uhi a me nā lawelawe plating i hāʻawi ʻia e BMG:

  • Hoʻoponopono
  • ʻO ka hoʻoulu ʻana
  • Phospatizing
  • ʻO Enameling
  • ʻEleʻele
  • Electroplating, electropolishing, a me ka pena ʻaʻahu uila
  • ʻO Chrome a me ka nickel plating
  • Palapala Plasma
  • ʻO ka uhi CVD a me PVD

Pena a me nā ʻaʻahu kala

E like me ka uhi ʻana a me ka hoʻopaʻa ʻana, ʻo ka pena a me ka uhi waihoʻoluʻu he ʻano lapaʻau ili metala i manaʻo nui ʻia e pale i ka ʻino. He mau kumu ʻē aʻe ko lākou: ka hoʻomalu ʻana a me ka pale ʻana i ka ʻinoʻino, ka ulu ʻana o ke ola kai ma nā wahi wai; hoʻonui i ka wela a me ka abrasion, a me ka paʻa; a hoʻemi i ka absorption o ka lā, a me nā mea ʻē aʻe. ʻO nā lawelawe pena a me ka uhi ʻana i hāʻawi ʻia e BMG:

  • ʻO ka uhiʻana o ka Powder
  • Pana pena
  • Pena Robotic

Nā Laʻau Lapaʻau Hou

Aia nā ʻano lapaʻau hoʻopau mīkini i hana ʻia ma mua o kekahi mau lapaʻau ʻili metala, hiki ke noʻonoʻo ʻia he ʻano lapaʻau ʻili me lākou iho. No ka laʻana, ke alakaʻi nei kekahi mau kaʻina plating i nā hopena ʻoi aku ka maikaʻi inā loaʻa kahi ʻāpana i kahi hoʻopau ʻili; pela no hoi, aole e pili pono ka pena i kekahi hapa lepo a momona mai ka hana ana. ʻO nā lāʻau lapaʻau hou o kēia ʻano i hāʻawi ʻia e BMG:

  • Pāhū one
  • Hoʻopau ʻo Roto
  • Barela hoʻopau
  • Hoʻomaʻemaʻe ʻāpana
  • Degreasing
  • Pāʻina
  • Lapalapa
  • Kuʻi kuʻi ʻana

E aʻo mai

ʻO nā hoʻomaʻamaʻa ʻili metala i kūkākūkā ʻia ma ʻaneʻi, he laʻana wale nō ia o nā lawelawe hoʻopau metala a BMG e hāʻawi ai, a ʻoi aku ka liʻiliʻi o kā mākou mau lawelawe lawelawe piha. No ka ʻike hou aku e pili ana i nā kaʻina hana hoʻopau hiki iā mākou ke hāʻawi, a me ke koena o kāu mau mea hiki, Hoʻokaʻaʻike BMG i kēia lā.